Europe

EU-I-2445007

Multichip Package Structure Using a Constant Voltage Power Supply

Europe

EU-I-EP2519080

Illuminating Apparatus and Method Thereof

Taiwan

TW-I-354365

Quasioptical LED Package Structure For Increasing Color Render Index and Brightness

Taiwan

TW-I-419373 

Multichip Package Structure Using Constant-Voltage Power Supply

Taiwan

TW-I-464920

Multi-Chip Package Structure and Method of Manufacturing the Same

Taiwan

TW-I-478626

Energy-Saving Illuminating Apparatus and Method Thereof

Taiwan

TW-I-603507

Light-Mixing Multichip Package Structure

Taiwan

TW-I-836724 

LED Illumination Device Avoiding No-Flux Situation and Color Temperature Switching Method Thereof

United States

US-I-8,217,404 B2

Light-Mixing Type LED Package Structure for Increasing Color Render Index

United States

US-I-8,672,517 B2

Light-Emitting Module

United States

US-I-8,899,789 B2

Lamp Module

United States

US-I-7,736,920 B1

LED Package Structure with Standby Bonding Pads for Increasing Wire-Bonding Yield and Method for Manufacturing the Same

United States

US-I-8,018,151 B2

Quasi-Optical LED Package Structure for Increasing Color Render Index and Brightness

United States

US-I-8,288,777 B2

LED Package Structure for Increasing Heat-Dissipating and Light-Emitting Efficiency and Method for Manufacturing the Same

United States

US-I-8,415,701 B2

LED Package Structure for Increasing Light-Emitting Efficiency and Controlling Light-Projecting Angle and Method for Manufacturing the Same

United States

US-I-8,421,373 B2

Light-Mixing Multichip Package Structure

United States

US-I-8,674,376 B2

LED Package Structure

United States

US-I-8,742,696 B2

Illuminating Apparatus and Method Thereof

United States

US-I-8,749,164 B2

Illuminating Apparatus Capable of Detecting Power Supply and Method Using the Same

United States

US-I-8,876,334 B2

Light-Mixing Multichip Package Structure

United States

US-I-9,018,662 B2

Multichip Package Structure

United States

US-I-9,029,883 B2

LED Package Structure with Concave Area for Positioning Heat-Conducting Substance

United States

US-I-9,433,103 B2

Method of Manufacturing a Multichip Package Structure

United States

US-I-9,451,662 B1

Alternating Current Light Emitting Device

United States

US-I-9,544,957 B1

Illumination Device

United States

US-I-9,698,133 B2

Method of Manufacturing a Multichip Package Structure

United States

US-I-9,803,846 B2

Circuit Substrate for Carrying at Least One Light-Emitting Diode and Light-Emitting Structure for Providing Illumination

United States

US-I-9,825,015 B2

Light-Mixing Multichip Package Structure

United States

US-I-9,857,049 B2

LED Illumination Device

United States

US-I-9,877,365 B1

Light-Emitting Device for Providing Flash Light Source

United States

US-I-9,989,199 B2

Illumination Device and Light-Emitting Module Thereof

United States

US-I-10,066,821 B1

Light-Emitting Device Having an Ambient Light Sensing Function

United States

US-I-10,952,301 B1

Lighting Device for Multiple Input Voltages

United States

US-I-11,202,357 B2

Two-Wire Dimming Lighting Device

United States

US-I-11,317,493 B2

LED Illumination Device

United States

US-I-11,333,347 B2

Illumination Device

United States

US-I-11,576,242 B1

LED Illumination Device for Improving Anti-Surge Capability

United States

US-I-11,716,801 B1

LED IlluminationDevice for RapidlyReleasingResidual Capacitance

United States

US-I-11,825,576 B1

LED Illuminating Device Without Using Capacitor

United States

US-I-11,844,156 B1

LED Illumination Device and Color Temperature Switching Method Thereof